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RH170

主營生產通訊設備、數碼家電、電腦等產品之主要電子基礎材料:銅箔基板,提供給客戶滿意的產品選擇與售后服務。

所屬分類:

產品關鍵詞:

通信設備

計算機

儀器儀表

關鍵詞:

普通FR-4 | 半固化片 | 無鉛兼容FR-4 | 無鹵兼容FR-4

產品描述

電子資訊工業近幾年來在中國的迅速發展下,結合各種相關產業,已經成為中國蓬勃發展、舉足輕重的新興產業。
江蘇諾德正是藉此信息產業化發展之平臺,以專業制造電子基礎材料為優勢,于2007年開始建立銅箔基板生產基地,憑借優秀的科技人才與創新的研發能力,配套發展生產通訊設備、數碼家電、電腦等產品之主要電子基礎材料:銅箔基板,提供給客戶滿意的產品選擇與售后服務。

nuode

RH170

 

 

(UL ANSI:FR-4.1)High Performance,High Tg Halogen-free

 

特點            

  1. 無鉛兼容FR-4
  2. 高Tg無鹵,UV Blocking/AOI兼容
  3. 不含鹵素、砷、紅磷等成份。

應用領域            
通信設備、計算機、儀器儀表、錄像機、電視機、電子游戲機等。

 

 FEATURES     

  1. Lead-free compatible FR-4
  2. High Tg Halogen-free ,UV Blocking/AOI compatible
  3. Free of constituents such as halogen,animony,red phosphorous,ect.

 APPLICATIONS     
Communication equipment , computer , instrumentation , VCR , TV , electronic game machine , and etc .

 

GENERAL PROPERTIES    

Test Item

Test condition

Units

Standard value

Typical value

1.Peel Strength , IBS/IN,Minimum,1 OZ

 

IBS/IN

 

 

As received

A

≥8.0

10.7

After thermal stress

A

≥8.0

10.7

2. Volume resistivity ,Minimum
At elevated temperature E-24/125

E-24/125

MΩ.cm  

≥103

≥106

3. Surface resistivity , Minimum                              
At elevated temperature E-24/125        

 E-24/125

≥103

≥106

4.Water absorption , Maximum

E-1/105+des

%

≤0.50

0.12

5.Dielectric Breakdown, Minimum

D-48/50 D-0.5/23

Kv

≥40

44

6. Flexural strength ,Minimum

 

Mpa

 

 

Length direction

A

≥415

580

Cross direction

A

≥345

460

7.Arc resistance ,Minimum

D-48/50
D-0.5/23

S

≥60

165

8.Flammability

A

S

UL-94V0

UL-94V0

9. Permittivity 1MHZ ,Maximum

A

 

≤5.4

4.6

10.Loss tangent 1MHZ ,Maximum

A

---

≤0.035

0.013

11.Thermal stress 288℃,10sec( Minimum )                    

 

---

 

 

Non etched specimen

A

NO DEFECT

NO DEFECT

Etched

A

NO DEFECT

NO DEFECT

12. TG(DSC,℃)

A

≥170

172

13.CTE(Z-axis)

Before Tg

PPM/℃

≤60

35

After Tg

PPM/℃

≤300

242

50-260℃

%

≤3.5

2.8

14.T260

TMA

min

≥30

60

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

                         Warpage of                                                                                        Warpage of

                        (No-treating)                                                                                       (After treating:125℃ 2hr)

nuode                                                   nuode

 

                  Peel strength

                       nuode

  ※Specimen T hickness:1.6mm single side board

 

PURCHASING INFORMATION    

 

Thickness

Copper foil

Standard Size

0.2mm  to  3.4mm

12μm  to    105μm

1041×1245mm(41″×49″)    940×1245mm(37″×49″)
1092×1245mm(43″×49″)    

※ Other sheet size and thickness could be available upon request.

 

合作意向表

Cooperation Intent Form